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    Ražotājs: INTEL

    Intel Core i3-10100


    €110,93 ar pvn

    Artikuls: ST04398214
    Preces kods: BX8070110100
    Ražotāja mājaslapa
    Garantija: 24 mēneši
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    Noliktava Piegāde Daudzums Cena
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    Specifikācija
    Procesora sērija Intel Core i3
    CPU ligzda LGA 1200
    Processor familyIntel® Core™ i3
    Processor cores4
    Processor socketLGA 1200 (Socket H5)
    Processor lithography14 nm
    BoxYes
    Cooler includedYes
    Processor manufacturerIntel
    Processor modeli3-10100
    Processor base frequency3.6 GHz
    Processor operating modes64-bit
    Processor generation10th gen Intel® Core™ i3
    Component forPC
    Processor threads8
    System bus rate8 GT/s
    Processor boost frequency4.3 GHz
    Processor cache6 MB
    Processor cache typeSmart Cache
    Thermal Design Power (TDP)65 W
    Memory bandwidth supported by processor (max)41.6 GB/s
    Processor codenameComet Lake
    Processor ARK ID199283
    Memory channelsDual-channel
    Maximum internal memory supported by processor128 GB
    Memory types supported by processorDDR4-SDRAM
    Memory clock speeds supported by processor2666 MHz
    ECCNo
    On-board graphics cardYes
    Discrete graphics cardNo
    On-board graphics card modelIntel® UHD Graphics 630
    Discrete graphics card modelNot available
    Maximum on-board graphics card memory64 GB
    On-board graphics card base frequency350 MHz
    On-board graphics card dynamic frequency (max)1100 MHz
    Number of displays supported (on-board graphics)3
    On-board graphics card 4K supportYes
    On-board graphics card DirectX version12.0
    On-board graphics card OpenGL version4.5
    On-board graphics card maximum resolution (DisplayPort)4096 x 2304 pixels
    On-board graphics card maximum resolution (eDP - Integrated Flat Panel)4096 x 2304 pixels
    On-board graphics card maximum resolution (HDMI)4096 x 2160 pixels
    On-board graphics card refresh rate at maximum resolution (DisplayPort)60 Hz
    On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel)60 Hz
    On-board graphics card refresh rate at maximum resolution (HDMI)30 Hz
    On-board graphics card ID0x9BC8
    Execute Disable BitYes
    Idle StatesYes
    Thermal Monitoring TechnologiesYes
    Market segmentDesktop
    Maximum number of PCI Express lanes16
    PCI Express slots version3.0
    PCI Express configurations1x16, 2x8, 1x8+2x4
    Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
    Scalability1S
    CPU configuration (max)1
    Embedded options availableNo
    Thermal solution specificationPCG 2015C
    PCI Express CEM revision3.0
    Export Control Classification Number (ECCN)5A992C
    Commodity Classification Automated Tracking System (CCATS)G077159
    Intel® Hyper Threading Technology (Intel® HT Technology)Yes
    Intel® Identity Protection Technology (Intel® IPT)Yes
    Intel® Turbo Boost Technology2.0
    Intel® Quick Sync Video TechnologyYes
    Intel® InTru™ 3D TechnologyYes
    Intel® Clear Video HD Technology (Intel® CVT HD)Yes
    Intel® AES New Instructions (Intel® AES-NI)Yes
    Enhanced Intel SpeedStep TechnologyYes
    Intel Trusted Execution TechnologyNo
    Intel® Thermal Velocity BoostNo
    Intel® Turbo Boost Technology 2.0 frequency4.3 GHz
    Intel® Transactional Synchronization ExtensionsNo
    Intel VT-x with Extended Page Tables (EPT)Yes
    Intel® Secure KeyYes
    Intel Stable Image Platform Program (SIPP)No
    Intel® OS GuardYes
    Intel Clear Video TechnologyYes
    Intel Software Guard Extensions (Intel SGX)Yes
    Intel 64Yes
    Intel Virtualization Technology (VT-x)Yes
    Intel Virtualization Technology for Directed I/O (VT-d)Yes
    Intel Turbo Boost Max Technology 3.0No
    Intel® Optane™ Memory ReadyYes
    Intel® Boot GuardYes
    Intel® vPro™ Platform EligibilityNo
    Tjunction100 °C
    Product typeProcessor
    Supported memory typesDDR4-SDRAM
    Maximum graphics card memory64 GB
    Harmonized System (HS) code85423119
    Package typeRetail box
    Processor package size37.5 x 37.5 mm
    Maximum internal memory128 GB
    Generation10th Generation
    Launch dateQ2'20
    Maximum resolution & refresh rate (DisplayPort)4096 x 2304@60Hz
    StatusLaunched
    Maximum memory128 GB
    Bus speed8 GT/s
    Processor ID0x9BC8
    Description
    Intel Core i3-10100. Processor family: Intel® Core™ i3, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. On-board graphics card model: Intel® UHD Graphics 630, Maximum on-board graphics card memory: 64 GB, On-board graphics card base frequency: 350 MHz. Market segment: Desktop, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.3 GHz
    Description
    Procesoru saime: Intel Core i3, Kodola nosaukums: Comet Lake, Procesora modelis: 10100, Ligzda: LGA 1200, Takts frekvence: 3.6 Ghz, Kodolu skaits: 4, Kešatmiņa: 6 MB, TDP: 65W, Procesora tehnoloģija: 14 nm, Integrēta video karte: Intel UHD Graphics 630, Garantija: 2 gadi
    Status7 dienas
    Description
    Intel® Optane™ Memory Supported Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Intel® Turbo Boost Technology Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t. Intel® Hyper-Threading Technology Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner. Intel® Virtualization Technology (VT-x) Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions. Intel® Virtualization Technology for Directed I/O (VT-d) Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments. Intel® VT-x with Extended Page Tables (EPT) Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management. Intel® 64 Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory. Instruction Set An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with. Instruction Set Extensions Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions). Idle States Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states. Enhanced Intel SpeedStep® Technology Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery. Thermal Monitoring Technologies Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits. Intel® Identity Protection Technology Intel® Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel® IPT provides a hardware-based proof of a unique user’s PC to websites, financial institutions, and network services; providing verification that it is not malware attempting to login. Intel® IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.

    Processor family Intel® Core™ i3
    Processor cores 4
    Processor socket LGA 1200 (Socket H5)
    Processor lithography 14 nm
    Box Y
    Cooler included Y
    Processor manufacturer Intel
    Processor model i3-10100
    Processor base frequency 3.6 GHz
    Processor operating modes 64-bit
    Processor generation 10th gen Intel® Core™ i3
    Component for PC
    Processor threads 8
    System bus rate 8 GT/s
    Processor boost frequency 4.3 GHz
    Processor cache 6 MB
    Processor cache type Smart Cache
    Thermal Design Power (TDP) 65 W
    Memory bandwidth supported by processor (max) 41.6 GB/s
    Processor codename Comet Lake
    Processor ARK ID 199283
    Memory channels Dual-channel
    Maximum internal memory supported by processor 128 GB
    Memory types supported by processor DDR4-SDRAM
    Memory clock speeds supported by processor 2666 MHz
    ECC N
    On-board graphics card Y
    Discrete graphics card N
    On-board graphics card model Intel® UHD Graphics 630
    Discrete graphics card model Not available
    Maximum on-board graphics card memory 64 GB
    On-board graphics card base frequency 350 MHz
    On-board graphics card dynamic frequency (max) 1100 MHz
    Number of displays supported (on-board graphics) 3
    On-board graphics card 4K support Y
    On-board graphics card DirectX version 12.0
    On-board graphics card OpenGL version 4.5
    On-board graphics card maximum resolution (DisplayPort) 4096 x 2304 pixels
    On-board graphics card maximum resolution (eDP - Integrated Flat Panel) 4096 x 2304 pixels
    On-board graphics card maximum resolution (HDMI) 4096 x 2160 pixels
    On-board graphics card refresh rate at maximum resolution (DisplayPort) 60 Hz
    On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel) 60 Hz
    On-board graphics card refresh rate at maximum resolution (HDMI) 30 Hz
    On-board graphics card ID 0x9BC8
    Execute Disable Bit Y
    Idle States Y
    Thermal Monitoring Technologies Y
    Market segment Desktop
    Maximum number of PCI Express lanes 16
    PCI Express slots version 3.0
    PCI Express configurations 1x16, 2x8, 1x8+2x4
    Supported instruction sets SSE4.1, SSE4.2, AVX 2.0
    Scalability 1S
    CPU configuration (max) 1
    Embedded options available N
    Thermal solution specification PCG 2015C
    PCI Express CEM revision 3.0
    Export Control Classification Number (ECCN) 5A992C
    Commodity Classification Automated Tracking System (CCATS) G077159
    Intel® Hyper Threading Technology (Intel® HT Technology) Y
    Intel® Identity Protection Technology (Intel® IPT) Y
    Intel® Turbo Boost Technology 2.0
    Intel® Quick Sync Video Technology Y
    Intel® InTru™ 3D Technology Y
    Intel® Clear Video HD Technology (Intel® CVT HD) Y
    Intel® AES New Instructions (Intel® AES-NI) Y
    Enhanced Intel SpeedStep Technology Y
    Intel Trusted Execution Technology N
    Intel® Thermal Velocity Boost N
    Intel® Turbo Boost Technology 2.0 frequency 4.3 GHz
    Intel® Transactional Synchronization Extensions N
    Intel VT-x with Extended Page Tables (EPT) Y
    Intel® Secure Key Y
    Intel Stable Image Platform Program (SIPP) N
    Intel® OS Guard Y
    Intel Clear Video Technology Y
    Intel Software Guard Extensions (Intel SGX) Y
    Intel 64 Y
    Intel Virtualization Technology (VT-x) Y
    Intel Virtualization Technology for Directed I/O (VT-d) Y
    Intel Turbo Boost Max Technology 3.0 N
    Intel® Optane™ Memory Ready Y
    Intel® Boot Guard Y
    Intel® vPro™ Platform Eligibility N
    Tjunction 100 °C
    Product type Processor
    Supported memory types DDR4-SDRAM
    Maximum graphics card memory 64 GB
    Harmonized System (HS) code 85423119
    Package type Retail box
    Processor package size 37.5 x 37.5 mm
    Maximum internal memory 128 GB
    Generation 10th Generation
    Launch date Q2'20
    Maximum resolution & refresh rate (DisplayPort) 4096 x 2304@60Hz
    Status Launched
    Maximum memory 128 GB
    Bus speed 8 GT/s
    Processor ID 0x9BC8
    DescriptionINTEL Core i3-10100 3.6GHz LGA1200 Boxed
    VatTypeVAT
    Weight0.440000000
    Height70.000000000
    Width110.000000000
    Length120.000000000
    Description
    INTEL Core i3-10100 3.6GHz LGA1200 6M Cache Boxed CPU
    Description
    Intel S1200 CORE i3 10100 BOX 4x3,6 65W GEN10

    Specifikācija
    Procesora sērija Intel Core i3
    CPU ligzda LGA 1200
    Processor familyIntel® Core™ i3
    Processor cores4
    Processor socketLGA 1200 (Socket H5)
    Processor lithography14 nm
    BoxYes
    Cooler includedYes
    Processor manufacturerIntel
    Processor modeli3-10100
    Processor base frequency3.6 GHz
    Processor operating modes64-bit
    Processor generation10th gen Intel® Core™ i3
    Component forPC
    Processor threads8
    System bus rate8 GT/s
    Processor boost frequency4.3 GHz
    Processor cache6 MB
    Processor cache typeSmart Cache
    Thermal Design Power (TDP)65 W
    Memory bandwidth supported by processor (max)41.6 GB/s
    Processor codenameComet Lake
    Processor ARK ID199283
    Memory channelsDual-channel
    Maximum internal memory supported by processor128 GB
    Memory types supported by processorDDR4-SDRAM
    Memory clock speeds supported by processor2666 MHz
    ECCNo
    On-board graphics cardYes
    Discrete graphics cardNo
    On-board graphics card modelIntel® UHD Graphics 630
    Discrete graphics card modelNot available
    Maximum on-board graphics card memory64 GB
    On-board graphics card base frequency350 MHz
    On-board graphics card dynamic frequency (max)1100 MHz
    Number of displays supported (on-board graphics)3
    On-board graphics card 4K supportYes
    On-board graphics card DirectX version12.0
    On-board graphics card OpenGL version4.5
    On-board graphics card maximum resolution (DisplayPort)4096 x 2304 pixels
    On-board graphics card maximum resolution (eDP - Integrated Flat Panel)4096 x 2304 pixels
    On-board graphics card maximum resolution (HDMI)4096 x 2160 pixels
    On-board graphics card refresh rate at maximum resolution (DisplayPort)60 Hz
    On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel)60 Hz
    On-board graphics card refresh rate at maximum resolution (HDMI)30 Hz
    On-board graphics card ID0x9BC8
    Execute Disable BitYes
    Idle StatesYes
    Thermal Monitoring TechnologiesYes
    Market segmentDesktop
    Maximum number of PCI Express lanes16
    PCI Express slots version3.0
    PCI Express configurations1x16, 2x8, 1x8+2x4
    Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
    Scalability1S
    CPU configuration (max)1
    Embedded options availableNo
    Thermal solution specificationPCG 2015C
    PCI Express CEM revision3.0
    Export Control Classification Number (ECCN)5A992C
    Commodity Classification Automated Tracking System (CCATS)G077159
    Intel® Hyper Threading Technology (Intel® HT Technology)Yes
    Intel® Identity Protection Technology (Intel® IPT)Yes
    Intel® Turbo Boost Technology2.0
    Intel® Quick Sync Video TechnologyYes
    Intel® InTru™ 3D TechnologyYes
    Intel® Clear Video HD Technology (Intel® CVT HD)Yes
    Intel® AES New Instructions (Intel® AES-NI)Yes
    Enhanced Intel SpeedStep TechnologyYes
    Intel Trusted Execution TechnologyNo
    Intel® Thermal Velocity BoostNo
    Intel® Turbo Boost Technology 2.0 frequency4.3 GHz
    Intel® Transactional Synchronization ExtensionsNo
    Intel VT-x with Extended Page Tables (EPT)Yes
    Intel® Secure KeyYes
    Intel Stable Image Platform Program (SIPP)No
    Intel® OS GuardYes
    Intel Clear Video TechnologyYes
    Intel Software Guard Extensions (Intel SGX)Yes
    Intel 64Yes
    Intel Virtualization Technology (VT-x)Yes
    Intel Virtualization Technology for Directed I/O (VT-d)Yes
    Intel Turbo Boost Max Technology 3.0No
    Intel® Optane™ Memory ReadyYes
    Intel® Boot GuardYes
    Intel® vPro™ Platform EligibilityNo
    Tjunction100 °C
    Product typeProcessor
    Supported memory typesDDR4-SDRAM
    Maximum graphics card memory64 GB
    Harmonized System (HS) code85423119
    Package typeRetail box
    Processor package size37.5 x 37.5 mm
    Maximum internal memory128 GB
    Generation10th Generation
    Launch dateQ2'20
    Maximum resolution & refresh rate (DisplayPort)4096 x 2304@60Hz
    StatusLaunched
    Maximum memory128 GB
    Bus speed8 GT/s
    Processor ID0x9BC8
    Description
    Intel Core i3-10100. Processor family: Intel® Core™ i3, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. On-board graphics card model: Intel® UHD Graphics 630, Maximum on-board graphics card memory: 64 GB, On-board graphics card base frequency: 350 MHz. Market segment: Desktop, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.3 GHz
    Description
    Procesoru saime: Intel Core i3, Kodola nosaukums: Comet Lake, Procesora modelis: 10100, Ligzda: LGA 1200, Takts frekvence: 3.6 Ghz, Kodolu skaits: 4, Kešatmiņa: 6 MB, TDP: 65W, Procesora tehnoloģija: 14 nm, Integrēta video karte: Intel UHD Graphics 630, Garantija: 2 gadi
    Status7 dienas
    Description
    Intel® Optane™ Memory Supported Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Intel® Turbo Boost Technology Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t. Intel® Hyper-Threading Technology Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner. Intel® Virtualization Technology (VT-x) Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions. Intel® Virtualization Technology for Directed I/O (VT-d) Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments. Intel® VT-x with Extended Page Tables (EPT) Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management. Intel® 64 Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory. Instruction Set An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with. Instruction Set Extensions Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions). Idle States Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states. Enhanced Intel SpeedStep® Technology Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery. Thermal Monitoring Technologies Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits. Intel® Identity Protection Technology Intel® Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel® IPT provides a hardware-based proof of a unique user’s PC to websites, financial institutions, and network services; providing verification that it is not malware attempting to login. Intel® IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.

    Processor family Intel® Core™ i3
    Processor cores 4
    Processor socket LGA 1200 (Socket H5)
    Processor lithography 14 nm
    Box Y
    Cooler included Y
    Processor manufacturer Intel
    Processor model i3-10100
    Processor base frequency 3.6 GHz
    Processor operating modes 64-bit
    Processor generation 10th gen Intel® Core™ i3
    Component for PC
    Processor threads 8
    System bus rate 8 GT/s
    Processor boost frequency 4.3 GHz
    Processor cache 6 MB
    Processor cache type Smart Cache
    Thermal Design Power (TDP) 65 W
    Memory bandwidth supported by processor (max) 41.6 GB/s
    Processor codename Comet Lake
    Processor ARK ID 199283
    Memory channels Dual-channel
    Maximum internal memory supported by processor 128 GB
    Memory types supported by processor DDR4-SDRAM
    Memory clock speeds supported by processor 2666 MHz
    ECC N
    On-board graphics card Y
    Discrete graphics card N
    On-board graphics card model Intel® UHD Graphics 630
    Discrete graphics card model Not available
    Maximum on-board graphics card memory 64 GB
    On-board graphics card base frequency 350 MHz
    On-board graphics card dynamic frequency (max) 1100 MHz
    Number of displays supported (on-board graphics) 3
    On-board graphics card 4K support Y
    On-board graphics card DirectX version 12.0
    On-board graphics card OpenGL version 4.5
    On-board graphics card maximum resolution (DisplayPort) 4096 x 2304 pixels
    On-board graphics card maximum resolution (eDP - Integrated Flat Panel) 4096 x 2304 pixels
    On-board graphics card maximum resolution (HDMI) 4096 x 2160 pixels
    On-board graphics card refresh rate at maximum resolution (DisplayPort) 60 Hz
    On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel) 60 Hz
    On-board graphics card refresh rate at maximum resolution (HDMI) 30 Hz
    On-board graphics card ID 0x9BC8
    Execute Disable Bit Y
    Idle States Y
    Thermal Monitoring Technologies Y
    Market segment Desktop
    Maximum number of PCI Express lanes 16
    PCI Express slots version 3.0
    PCI Express configurations 1x16, 2x8, 1x8+2x4
    Supported instruction sets SSE4.1, SSE4.2, AVX 2.0
    Scalability 1S
    CPU configuration (max) 1
    Embedded options available N
    Thermal solution specification PCG 2015C
    PCI Express CEM revision 3.0
    Export Control Classification Number (ECCN) 5A992C
    Commodity Classification Automated Tracking System (CCATS) G077159
    Intel® Hyper Threading Technology (Intel® HT Technology) Y
    Intel® Identity Protection Technology (Intel® IPT) Y
    Intel® Turbo Boost Technology 2.0
    Intel® Quick Sync Video Technology Y
    Intel® InTru™ 3D Technology Y
    Intel® Clear Video HD Technology (Intel® CVT HD) Y
    Intel® AES New Instructions (Intel® AES-NI) Y
    Enhanced Intel SpeedStep Technology Y
    Intel Trusted Execution Technology N
    Intel® Thermal Velocity Boost N
    Intel® Turbo Boost Technology 2.0 frequency 4.3 GHz
    Intel® Transactional Synchronization Extensions N
    Intel VT-x with Extended Page Tables (EPT) Y
    Intel® Secure Key Y
    Intel Stable Image Platform Program (SIPP) N
    Intel® OS Guard Y
    Intel Clear Video Technology Y
    Intel Software Guard Extensions (Intel SGX) Y
    Intel 64 Y
    Intel Virtualization Technology (VT-x) Y
    Intel Virtualization Technology for Directed I/O (VT-d) Y
    Intel Turbo Boost Max Technology 3.0 N
    Intel® Optane™ Memory Ready Y
    Intel® Boot Guard Y
    Intel® vPro™ Platform Eligibility N
    Tjunction 100 °C
    Product type Processor
    Supported memory types DDR4-SDRAM
    Maximum graphics card memory 64 GB
    Harmonized System (HS) code 85423119
    Package type Retail box
    Processor package size 37.5 x 37.5 mm
    Maximum internal memory 128 GB
    Generation 10th Generation
    Launch date Q2'20
    Maximum resolution & refresh rate (DisplayPort) 4096 x 2304@60Hz
    Status Launched
    Maximum memory 128 GB
    Bus speed 8 GT/s
    Processor ID 0x9BC8
    DescriptionINTEL Core i3-10100 3.6GHz LGA1200 Boxed
    VatTypeVAT
    Weight0.440000000
    Height70.000000000
    Width110.000000000
    Length120.000000000
    Description
    INTEL Core i3-10100 3.6GHz LGA1200 6M Cache Boxed CPU
    Description
    Intel S1200 CORE i3 10100 BOX 4x3,6 65W GEN10
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